Ning Li obtained his B.S. from Tsinghua University and his Ph.D. from the University of Texas at Austin, TX. Before joining Lehigh, he was a Research Staff Member at IBM T. J. Watson Research Center, Yorktown Heights, NY. His research work is related to memory devices and their applications in neuromorphic computing, flexible and new form factor devices and systems, photonic devices for communication and quantum applications, advanced packaging and heterogeneous integration, organic electronics, etc. He was awarded more than 200 US patents, many IBM High Value Patent Awards, IBM Invention Achievement Awards, and Master Inventor Awards. He has publications in major scientific journals and conferences including Nature Photonics, Nature Communications, Advanced Materials, OFC, VLSI, IEDM, etc. His work has been featured on Nature Research Highlight, Semiconductor Today, Nanowerk most popular spotlight article, etc. Ning Li is currently an Associate Professor with the Department of Electrical and Computer Engineering at Lehigh University.
[1] N. Li*, C. Mackin, A. Chen, K. Brew, T. Philip, A. Simon, I. Saraf, J. Han, S. Sarwat, G.W. Burr, M. Rasch, A. Sebastian, V. Narayanan, N. Saulnier, “Optimization of Projected Phase Change Memory for Analog In-Memory Computing Inference,” Advanced Electronic Materials, 2023
[2] N. Li*, H. Tsai, V. Narayanan, Malte Rasch* “Impact of Analog Memory Device Failure on In-Memory Computing Inference Accuracy,” APL Machine Learning, 2023
[3] N. Li*, K. Han, W. Spratt, S. Bedell, J. Ren, O. Gunawan, J. Ott, M. Hopstaken, C. Cabril, Jr., F. Libsch, C. Subramaniam, G. Shaidi, D. Sadana, “Dust-Sized High-Power-Density Photovoltaic Cells on Si and SOI Substrates for Wafer-Level-Packaged Small Edge Computers,” Advanced Materials 32, 2004573, 2020
[4] N. Li*, K. Han, W. Spratt, S. Bedell, J. Ott, M. Hopstaken, F. Libsch, Q. Li, D. Sadana, “Ultra-Low-Power Sub-Photon-Voltage High-Efficiency Light-Emitting Diodes,” Nature Photonics 13, 588, 2019
[5] N. Li*, K. Han, V. Sorger, D. Sadana, “Nanoscale Light Sources for Optical Interconnects,” J Laser Opt Photonics 4, e114, 2017, Editorial
[6] N. Li*, S. Bedell, H. Hu, S.-J. Han, X. H. Liu, K. Saenger, D. Sadana, “Single Crystal Flexible Electronics Enabled by 3D Spalling,” Advanced Materials 29, VIP paper, 1606638, 2017
[7] K. Liu, N. Li*, D. K. Sadana, V. J. Sorger*, “Integrated Nano-Cavity Plasmon Light-Sources for on-Chip Optical Interconnects,” ACS Photonics 3, 233-242, 2016
[8] N. Li*, K. Liu, V. Sorger, D. Sadana, “Monolithic III-V on Si Plasmonic Nanolaser Structure for Optical Interconnects,” Scientific Reports 5, 14067, 2015
[9] C. Cheng*, K. Shiu, N. Li, S. J. Han, L. Shi, D. K. Sadana, “Epitaxial Lift-off Process for Gallium Arsenide Substrate Reuse and Flexible Electronics,” Nature Communications 4, 1577, 2013
[10] N. Li*, S. Oida, G.S. Tulevski, S. Han, J.B. Hannon, D.K. Sadana, T.C. Chen, “Efficient and Bright Organic Light-Emitting Diodes on Single-Layer Graphene Electrodes,” Nature Communications 4, 2294, 2013
